JPH03101549U - - Google Patents
Info
- Publication number
- JPH03101549U JPH03101549U JP896790U JP896790U JPH03101549U JP H03101549 U JPH03101549 U JP H03101549U JP 896790 U JP896790 U JP 896790U JP 896790 U JP896790 U JP 896790U JP H03101549 U JPH03101549 U JP H03101549U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- mounting
- notch
- shaped spring
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP896790U JPH03101549U (en]) | 1990-02-02 | 1990-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP896790U JPH03101549U (en]) | 1990-02-02 | 1990-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101549U true JPH03101549U (en]) | 1991-10-23 |
Family
ID=31512577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP896790U Pending JPH03101549U (en]) | 1990-02-02 | 1990-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101549U (en]) |
-
1990
- 1990-02-02 JP JP896790U patent/JPH03101549U/ja active Pending